Importance

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Abstract

There is provided a semiconductor device which includes a plurality of first through-substrate vias that are used to supply power from a first power supply and that penetrate through a substrate structure, and a plurality of second through-substrate vias that are used to supply power from a second power supply different from the first power supply and that penetrate through a substrate structure. The semiconductor device also includes a through-substrate via string composed by the first and second through-substrate vias, in which the first through-substrate vias are located adjacent to one another and the second through-substrate vias are also located adjacent to one another. The through-substrate via string is disposed in the substrate structure for extending in a first direction.

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First Claim