Closed loop liquid cooling system for electronic packages
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United States of America Patent
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Mar 29, 2016
Grant Date -
May 21, 2015
app pub date -
Nov 21, 2013
filing date -
Nov 21, 2013
priority date (Note) -
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Abstract
A closed loop liquid cooling system for electronic packages, the closed loop liquid cooling system including: a fan impeller configured so that air flows from the fan impeller through a radiator of the closed loop liquid cooling system; an electric motor coupled to the fan impeller, the electric motor configured to rotate the fan impeller; and a pump impeller configured for delivering liquid to the electronic package via a cold plate, the pump impeller mechanically coupled to the fan impeller such that rotating the fan impeller causes the pump impeller to rotate such that liquid is circulated in the closed loop liquid cooling system.
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