Resin production method and resin production apparatus
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United States of America Patent
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Oct 25, 2016
Grant Date -
May 21, 2015
app pub date -
Jul 17, 2013
filing date -
Jul 24, 2012
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Abstract
Provided is a resin production method in which a mold release force applied between a mold and a curable resin is reduced in a resin production method using a nano-imprint method. The resin production method includes an arrangement step of arranging a curable composition (1) on a substrate (2); a contacting step of bringing a mold (3) into contact with the curable composition (1); a curable composition curing step of curing the curable composition (1) by irradiating the curable composition (1) with a radiation or heating the curable composition (1) while keeping the curable composition (1) in contact with the mold (3); a tensile stress generation step of generating a tensile stress (6) in a direction of spacing the substrate (2) and the mold (3) away from each other to such a degree that the mold (3) and the curable composition (1) are not spaced away from each other when the curable composition (1) is cured; and a mold release step of releasing the curable composition (1) and the mold (3) from each other.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- CANON KABUSHIKI KAISHA
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Iida, Kenichi | Kawasaki, JP | 106 | 835 |
Ito, Toshiki | Kawasaki, JP | 120 | 660 |
Matsufuji, Naoko | Yokohama, JP | 6 | 51 |
Suzuki, Tatsuya | Kawasaki, JP | 542 | 6229 |
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