Adhesion method using thin adhesive layers

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United States of America Patent

PATENT NO 10934458
APP PUB NO 20150140307A1
SERIAL NO

14609832

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Abstract

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The invention relates to a method for adhering flexible substrates, the connecting adhesive layer being formed in a thin manner. The invention further relates to a composite substrate, wherein the two substrates are connected by a thin flexible adhesive layer.

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Patent Owner(s)

  • HENKEL AG & CO. KGAA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gierlings, Michael Hilden, DE 5 5
Kinzelmann, Hans-Georg Pulheim, DE 41 106

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