Crack control for substrate separation

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United States of America Patent

PATENT NO 9368407
APP PUB NO 20150140831A1
SERIAL NO

14592421

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Abstract

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A method for separating a layer for transfer includes forming a crack guiding layer on a substrate and forming a device layer on the crack-guiding layer. The crack guiding layer is weakened by exposing the crack-guiding layer to a gas which reduces adherence at interfaces adjacent to the crack guiding layer. A stress inducing layer is formed on the device layer to assist in initiating a crack through the crack guiding layer and/or the interfaces. The device layer is removed from the substrate by propagating the crack.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES U S INC400 STONEBREAK ROAD EXTENSION MALTA NY 12020

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bedell, Stephen W Wappingers Falls, US 409 5503
Cheng, Cheng-Wei White Plains, US 142 576
Sadana, Devendra K Pleasantville, US 897 9865
Saenger, Katherine L Ossining, US 127 2890
Shiu, Kuen-Ting White Plains, US 122 769

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