RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD
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United States of America Patent
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app pub date -
Jan 28, 2015
filing date -
Mar 7, 2011
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Abandoned
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Abstract
A resin composition comprises a polyimide resin, a thermosetting resin, and a filler, the polyimide resin containing a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol %.
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