AREA-EFFICIENT PRESSURE SENSING DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20150143926A1
SERIAL NO

14088397

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Circuits, methods, and apparatus that provide pressure sensing devices having a pressure sensor including a diaphragm supported by a frame. The pressure sensor may be mounted on an application-specific integrated circuit. A passage may extend through the application-specific integrated circuit from its underside to its topside where it may terminate in a cavity formed under the diaphragm. Circuit components may be formed in the second wafer portion and located in areas that are not under the first wafer portion. Circuit components may be formed in the second wafer in areas under the first wafer portion, such as under the frame or under the diaphragm. Circuit components may be formed in the second wafer such that they are partially under the first wafer portion, or partially under the frame or partially under the diaphragm.

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Patent Owner(s)

Patent OwnerAddress
SILICON MICROSTRUCTURES INC1701 MCCARTHY BOULEVARD MILPITAS CA 95035

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doering, Holger Sunnyvale, US 8 34

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