HEAT DISSIPATION SUBSTRATE
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United States of America Patent
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N/A
Issued Date -
May 28, 2015
app pub date -
Jan 13, 2014
filing date -
Nov 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A heat dissipation substrate includes a heat sink, a metal base and an elastic structure. The heat sink includes a carrying portion and supporting portions. The supporting portions are parallel to one another and disposed on a lower surface of the carrying portion. The supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion. The carrying portion has first rough surface structure disposed on a portion of the lower surface and located in the accommodating space. The metal base is disposed below the heat sink and has an assemble surface and a second rough surface structure disposed on a portion of the assemble surface and corresponding to the first rough surface structure. The first and second rough surface structures and the supporting portions define a fluid chamber in which the elastic structure is disposed, and a working fluid flows in the fluid chamber.
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