WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRING BOARD
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United States of America Patent
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Issued Date -
May 28, 2015
app pub date -
Nov 25, 2014
filing date -
Nov 28, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring board of the present invention includes an insulating board having a mounting portion on an upper surface to mount a semiconductor element, and semiconductor element connection pads formed on the mounting portion, on which at least three first dummy pads arranged on a center portion of the mounting portion, and at least three second dummy pads arranged on a peripheral portion of the mounting portion, are formed, and a dummy solder bump is formed on each of the first dummy pad and the second dummy pad.
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