MATRIX LEADFRAME FOR LED PACKAGING
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United States of America Patent
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Issued Date -
May 28, 2015
app pub date -
Jul 16, 2013
filing date -
Jul 24, 2012
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A leadframe (610) is formed that simplifies the packaging of light emitting elements and/or eliminates the need for stress-inducing folding after encapsulation. In particular, the folding of the contact tabs (505, 506) for surface mounting is performed prior to the mounting and encapsulation of the light emitting elements on the leadframe. In an example embodiment, the leadframe may be formed so that an array, or matrix, of light emitting elements may be packaged during a single packaging process.
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