Solderless hearing assistance device assembly and method
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United States of America Patent
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Mar 6, 2018
Grant Date -
May 28, 2015
app pub date -
Nov 27, 2013
filing date -
Nov 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
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