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United States of America Patent
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Issued Date -
Jun 4, 2015
app pub date -
Jul 8, 2013
filing date -
Jul 6, 2012
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Abstract
A laminate for forming a package is provided. Two layers of the laminate are bonded utilising a pressure sensitive adhesive. Flap areas are cut in the layers of the laminate with cuts in different layers being offset from one another such that the flap areas can be opened and resealed.
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