METHOD AND DEVICE FOR CONTROLLING PATTERN AND STRUCTURE FORMATION BY AN ELECTRIC FIELD

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United States of America Patent

SERIAL NO

14577013

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Abstract

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A processing method and apparatus uses at least one electric field applicator (34) biased to produce a spatial-temporal electric field to affect a processing medium (26), suspended nano-objects (28) or the substrate (30) in processing, interacting with the dipole properties of the medium (26) or particles to construct structure on the substrate (30). The apparatus may include a magnetic field, an acoustic field, an optical force, or other generation device. The processing may affect selective localized layers on the substrate (30) or may control orientation of particles in the layers, control movement of dielectrophoretic particles or media, or cause suspended particles of different properties to follow different paths in the processing medium (26). Depositing or modifying a layer on the substrate (30) may be carried out. Further, the processing medium (26) and electrical bias may be selected to prepare at least one layer on the substrate (30) for bonding the substrate (30) to a second substrate, or to deposit carbon nanotubes (CNTs) with a controlled orientation on the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brcka, Jozef Austin, US 57 2449
Faguet, Jacques Austin, US 51 3340
Lee, Eric M Austin, US 34 2881
Yue, Hongyu Henry Plano, US 2 18

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