Wire-pull test location identification on a wire of a microelectronic package

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United States of America Patent

PATENT NO 9255867
APP PUB NO 20150153261A1
SERIAL NO

14093841

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mechanism is provided for identifying a wire-pull test location on a wire of a microelectronic package. A first distance between a first terminating location of the wire on the microelectronic package and a second terminating location of the wire on the microelectronic package is determined. Based on the first distance, a second distance from either the first terminating location or the second terminating location is determined as the wire-pull test location for testing a strength of a connection of the wire to at least one of the first terminating location or the second terminating location. An adjustment is performed such that a visual guide is oriented on the wire at the wire-pull test location.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lam, Mark T W Singapore, SG 3 1
Yonehara, Katsuyuki Kanagawa-ken, JP 8 82

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