SUBSTRATE TREATING APPARATUS AND METHOD
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United States of America Patent
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Issued Date -
Jun 4, 2015
app pub date -
Dec 1, 2014
filing date -
Nov 29, 2013
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Abstract
Provided is a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a predetermined process is performed on a substrate, a pressure meter measuring a pressure within the process chamber, and a controller receiving the measured pressure value from the pressure meter to determine an opening time of the process chamber. The controller opens the process chamber when a set condition elapses from a time at which the pressure within the process chamber reaches a preset opening pressure.
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