Printed Semiconductor Junctions
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United States of America Patent
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N/A
Issued Date -
Jun 4, 2015
app pub date -
Dec 3, 2014
filing date -
Dec 3, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein is a thermoelectric module and a method of producing a thermoelectric module via printing techniques. The method can include providing a first ink, the first ink including a first population of n-material semiconductor nanomaterials suspended in a solvent, and providing a second ink, the second ink including a second population of p-material semiconductor nanomaterials suspended in a solvent. Further, the method can include printing the first ink and the second ink on a substrate and applying a conducting layer electronically contacting both the first ink and the second ink printed on the substrate. The method may also include heating the substrate
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