METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE

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United States of America Patent

SERIAL NO

14618483

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Abstract

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A method for manufacturing a semiconductor laser device includes preparing an original substrate having a plurality of semiconductor laser device regions arrayed in a matrix, and a plurality of ridges formed in stripes so as to pass through each of the plurality of semiconductor laser device regions that are aligned in one direction. A scribing process is applied to the original substrate along cutting lines set along boundaries of the plurality of semiconductor laser device regions from a rear surface at an opposite side of a top surface at which the ridges are formed. A blade is applied to the original substrate along each cutting line from the top surface of the original substrate for dividing the original substrate along the cutting line.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 615-8585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KASHIWAGI, Junichi Kyoto, JP 10 324
KUBOTA, Masashi Kyoto, JP 41 818
OKAMOTO, Kuniyoshi Kyoto, JP 23 2035
TANAKA, Taketoshi Kyoto, JP 37 490

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