Copper electrodeposition bath containing an electrochemically inert cation

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United States of America Patent

PATENT NO 10011914
SERIAL NO

14482617

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Abstract

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The present invention relates to an electrolyte composition for depositing copper on metal substrates. The composition contains a combination of two aromatic amines and an electrochemically inert cation. This electrolyte makes it possible to increase the copper nucleation density. It also allows bottom-up filling in trenches that have a very small opening dimension, typically lower than 40 nm.

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Patent Owner(s)

  • ALCHIMER

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blondeau, Paul Paris, FR 2 2
Religieux, Laurianne Chatenay Malabry, FR 3 10
Suhr, Dominique Antony, FR 10 28

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