Intelligent chip placement within a three-dimensional chip stack
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United States of America Patent
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Mar 8, 2016
Grant Date -
Jun 11, 2015
app pub date -
May 15, 2014
filing date -
Dec 5, 2013
priority date (Note) -
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Abstract
An integrated circuit (IC) stack device for thermal management is disclosed. The IC stack device can include a primary IC having a first set of cores with a ratio of first enabled cores and first disabled cores. The IC stack device can also have a supplementary IC interfaced with the primary IC, and having a second set of cores with a second ratio of second enabled cores and second disabled cores, with the second ratio being less than the first ratio. The integrated circuit stack device can also include a cooling element located such that the primary integrated circuit is between the cooling element and the supplementary integrated circuit. The cooling element can be designed to facilitate heat dissipation of the first and second enabled cores of the primary integrated circuit and the supplementary integrated circuit.
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