INTEGRATED WIRE BONDER AND 3D MEASUREMENT SYSTEM WITH DEFECT REJECTION

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United States of America Patent

APP PUB NO 20150162299A1
SERIAL NO

14523338

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Abstract

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An apparatus comprises a wire bonder system including a wire bonding device, a measuring device and a rejection device. The wire bonding device is configured to attach wire bond type electrical interconnect to an electronic assembly. A wire bond is formed between a first semiconductor device and a second electronic device to form at least a portion of the electronic assembly. The measuring device is configured to perform a three dimensional measurement associated with a wire bond, and the rejection device is configured to identify an electronic assembly for rejection according to the three dimensional wire bond measurement.

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Patent Owner(s)

Patent OwnerAddress
FAIRCHILD SEMICONDUCTOR CORPORATION5005 E MCDOWELL ROAD MAILDROP A700 PHOENIX AS 85008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Keller, Daren W Madbury, US 2 2

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