Semiconductor Package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jun 11, 2015
app pub date -
Jun 10, 2014
filing date -
Dec 11, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed is a semiconductor package. The semiconductor package includes a substrate formed with transistors, power metal lines formed on the substrate, data metal lines formed on the substrate to transmit and receive data to and from the transistors, and an insulating layer formed on the substrate, the power metal lines, and the data metal lines. Herein, the insulating layer has openings partially exposing the power metal lines.
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