Laser processing of sapphire substrate and related applications

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United States of America Patent

PATENT NO 9676167
SERIAL NO

14529976

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Abstract

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A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

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Patent Owner(s)

  • CORNING INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marjanovic, Sasha Painted Post, US 47 1188
Piech, Garrett Andrew Corning, US 78 1492
Tsuda, Sergio Horseheads, US 54 2383
Wagner, Robert Stephen Corning, US 47 1330

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