STACKED TRANSPARENT MATERIAL CUTTING WITH ULTRAFAST LASER BEAM OPTICS, DISRUPTIVE LAYERS AND OTHER LAYERS
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United States of America Patent
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Oct 31, 2014
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Dec 17, 2013
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Abstract
A method of laser drilling, forming a perforation, cutting, separating or otherwise processing a material includes focusing a pulsed laser beam into a laser beam focal line, and directing the laser beam focal line into a workpiece comprising a stack including at least: a first layer, facing the laser beam, the first layer being the material to be laser processed, a second layer comprising a carrier layer, and a laser beam disruption element located between the first and second layers, the laser beam focal line generating an induced absorption within the material of the first layer, the induced absorption producing a defect line along the laser beam focal line within the material of the first layer. The beam disruption element may be a beam disruption layer or a beam disruption interface.
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