MEMS encapsulation by multilayer film lamination

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United States of America Patent

PATENT NO 9156678
APP PUB NO 20150166333A1
SERIAL NO

14104915

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Abstract

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This disclosure provides systems, methods and apparatus for a laminated film enclosing an array of microelectromechanical systems (MEMS) structures. In one aspect, a MEMS apparatus includes a substrate having a device region and an edge region surrounding the device region and an array of MEMS structures on the substrate at the device region. A protective layer is disposed over the array of MEMS structures. A laminated film is disposed over the protective layer and in contact with the substrate to form a seal at the edge region, where the laminated film forms a cavity between the substrate and the laminated film at the device region. The laminated film includes a moisture barrier layer facing away from the array of MEMS structures, and a desiccant layer facing toward the array of MEMS structures.

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Patent Owner(s)

  • SNAPTRACK, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kao, Tsongming Sunnyvale, US 16 118
Li, Wenguang Fremont, US 54 552

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