COMPOSITION FOR FORMING A SEED LAYER
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Jul 12, 2013
filing date -
Jul 12, 2012
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Abstract
A composition for forming a seed layer, the composition comprising: (a.) a first metal fine particle; and (b.) a metallic component selected from a metal oxide fine particle, an organic metal complex, a second metal fine particle, and combinations thereof, wherein the second metal fine particle has a greater affinity for oxygen than the first fine particle. A seed layer as defined, and a coating including a seed layer and the use of this coating. Further, the invention relates to a method of forming a seed layer comprising applying a composition comprising a first metal fine particle, and a metallic component selected from a metal oxide fine particle, an organic metal complex, a second fine metal particle, and combinations thereof, wherein the second metal fine particle has a greater affinity for oxygen than the first metal fine particle to a surface of a substrate, and setting the composition.
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