POLISHING COMPOSITION, MANUFACTURING PROCESS THEREFOR, UNDILUTED LIQUID, PROCESS FOR PRODUCING SILICON SUBSTRATE, AND SILICON SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Jan 16, 2013
filing date -
Jan 16, 2012
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Abandoned
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Abstract
A polishing composition is obtained through diluting an undiluted liquid containing abrasive grains. When R1 is defined as an average secondary particle diameter of the abrasive grains in the undiluted liquid and R2 is defined as an average secondary particle diameter of the abrasive grains in the polishing composition, the ratio R2/R1 is 1.2 or less. The polishing composition is used for polishing a silicon substrate material to produce a silicon substrate.
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