SECURE CAGE CREATED BY RE-DISTRIBUTION LAYER METALLIZATION IN FAN-OUT WAFER LEVEL PACKAGING PROCESS
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Dec 15, 2014
filing date -
Dec 13, 2013
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Abstract
A system and method for disposing a secure conductive mesh into an encapsulant material of an integrated circuit package to thereby at least partially physically surround dies within the integrated circuit packages, circuit pathways and other components in order to physically protect secure data from being probed by a device that alters a capacitance signal from the secure mesh.
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