Importance

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Abstract

In a plate attaching step, a plate is attached to a front side of a device wafer through an adhesive. In a grinding step, the device wafer is held by a holding table through the plate, and an exposed back side of the device wafer is ground by grinding means to thin the device wafer down to a predetermined thickness. In a dicing step, the device wafer is divided along division lines from the side of the back side thereof, to form a plurality of chips. In a picking-up step, the chips are individually picked up from the plate. The plate is substantially the same as the device wafer in size, and, therefore, an increase in the size of a dicing apparatus can be restrained even when the device wafers to be processed are enlarged in diameter.

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First Claim