Apparatuses and methods for die seal crack detection

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United States of America Patent

PATENT NO 9287184
APP PUB NO 20150170979A1
SERIAL NO

14106190

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dennison, Charles H Meridian, US 269 8605
Ireland, Philip J Nampa, US 71 1309
Marr, Kenneth W Boise, US 68 783
Thimmegowda, Deepak Boise, US 33 262

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