Integrated circuit packaging system with embedded component and method of manufacture thereof

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United States of America Patent

PATENT NO 9171795
APP PUB NO 20150171002A1
SERIAL NO

14556992

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Abstract

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An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, including: an embedding material on a component; a mask layer on the embedding material; a buried pattern in the mask layer, the outer surface of the buried pattern coplanar with the outer surface of the mask layer, the buried pattern electrically connected to the component; a patterned dielectric on a portion of the buried pattern; and an integrated circuit die on the buried pattern.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Dong Ju Seoul, KR 18 37
Jung, JinHee Busan, KR 38 44
Park, KyoungHee Seoul, KR 31 50
Roh, YoungDal Icheon-si, KR 6 20

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