INTEGRATED CIRCUITS WITH DUMMY CONTACTS AND METHODS FOR PRODUCING SUCH INTEGRATED CIRCUITS
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United States of America Patent
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Issued Date -
Jun 18, 2015
app pub date -
Dec 17, 2013
filing date -
Dec 17, 2013
priority date (Note) -
Abandoned
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Abstract
Integrated circuits with dummy contacts and methods for fabricating such integrated circuits are provided. The method includes forming an interlayer dielectric overlying an electronic component and a substrate, wherein the interlayer dielectric has an interlayer dielectric top surface. An active contact is formed through the interlayer dielectric and forms an electrical connection with the electronic component. A dummy contact is formed within the interlayer dielectric where the dummy contact extends to a dummy contact termination point between the interlayer dielectric top surface and the substrate such that an insulator is positioned between the dummy contact termination point and the electronic component.
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