MULTI-LAYER PRINTED CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 18, 2015
app pub date -
Dec 15, 2014
filing date -
Dec 18, 2013
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A multi-layer printed circuit board includes a first layer, a second layer, at least one third layer, a conductive via hole, and a capacitor electronically coupled to the conductive via hole. The at least one third layer is sandwiched between the first and second layers. The conductive via hole is defined through the first, second and third layers, and having a parasitic inductance. The capacitor and the parasitic inductance of the conductive via hole cooperatively form a low-pass filter that is configured to filter noise signal induced by conductive via hole due to the parasitic inductance.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully