Method of manufacturing printed circuit board and printed circuit board
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United States of America Patent
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Aug 23, 2016
Issued Date -
N/A
app pub date -
Dec 9, 2014
filing date -
Dec 17, 2013
priority date (Note) -
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Abstract
A method of manufacturing a printed circuit board includes: supplying solder paste so as to be offset from an electrode pad of a printed wiring board; flowing the solder paste during melting; and forming a region that is not covered with solder resist on the outer peripheral region adjacent to the electrode pad of the printed wiring board to which solder paste is supplied, thereby increasing a gap between a semiconductor package and the printed wiring board to prevent separation of the solder.
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