LAMINATED POLISHING PAD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Jun 25, 2015
app pub date -
May 20, 2013
filing date -
Jul 24, 2012
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Abstract
The purpose of the present invention is to provide a method for manufacturing a laminated polishing pad in which a polishing layer and a support layer resist delamination even when heated to high temperature due to long-time polishing, and the support layer is less likely to wrinkle. This method for manufacturing a laminated polishing pad, comprising the steps of: preparing a laminate comprising a polishing layer, a support layer, and a hot-melt adhesive member placed between the polishing layer and the support layer; and allowing the laminate to pass between a pair of lamination rolls so that the polishing layer and the support layer are bonded with the hot-melt adhesive member to form a laminated polishing sheet, wherein in the laminate, the ratio TD1 (TD length of the polishing layer)/TD2 (TD length of the support layer) is constantly adjusted to 0.3 or more.
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