Mold for manufacturing a component
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United States of America Patent
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Mar 20, 2018
Grant Date -
Jun 25, 2015
app pub date -
Mar 2, 2015
filing date -
Mar 14, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A mold for manufacturing a component is provided. A mold has a mold surface representing a negative image of the component. The mold has openings in the mold surface. Flow channels extending from the openings in the mold surface and are connectable to a suction device. Further, the mold has a periphery delimiting the mold surface. A bag is fixed to the periphery of the mold. The bag is inflated to a pressure level above ambient pressure. The pressure is released from the bag while sucking the bag to the mold surface using the suction device. Fabrics are layered onto the bag while the bag is kept sucked to the mold surface. Resin is introduced into the fabrics and then the resin is cured.
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