Robot with integrated aligner
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United States of America Patent
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Mar 29, 2016
Grant Date -
Jun 25, 2015
app pub date -
Dec 23, 2013
filing date -
Dec 23, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A robot with an integrated aligner is provided that allows for the alignment of a semiconductor wafer while the semiconductor wafer transits between multiple stations. The robot with an integrated aligner may contain a rotational wafer support configured to rotate and/or translate, one or multiple robotic arms, and a sensor. The robot may pick and place the semiconductor wafer with the robotic arm from or into a station and from or onto the rotational wafer support. The robot may be configured to rotate the semiconductor wafer into a desired orientation when the semiconductor wafer is on the rotational wafer support. The rotation of the semiconductor wafer into a desired orientation may be aided the sensor. The robot may have a positioning mechanism which moves it between different positions in a semiconductor tool.
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