BARRIER-LESS METAL SEED STACK AND CONTACT

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United States of America Patent

APP PUB NO 20150179834A1
SERIAL NO

14137610

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Approaches for forming barrier-less seed stacks and contacts are described. In an example, a solar cell includes a substrate and a conductive contact disposed on the substrate. The conductive contact includes a copper layer directly contacting the substrate. In another example, a solar cell includes a substrate and a seed layer disposed directly on the substrate. The seed layer consists essentially of one or more non-diffusion-barrier metal layers. A conductive contact includes a copper layer disposed directly on the seed layer. An exemplary method of fabricating a solar cell involves providing a substrate, and forming a seed layer over the substrate. The seed layer includes one or more non-diffusion-barrier metal layers. The method further involves forming a conductive contact for the solar cell from the seed layer.

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Patent Owner(s)

Patent OwnerAddress
SUNPOWER CORPORATION51 RIO ROBLES SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Agrawal, Mukul Fremont, US 8 231
Cudzinovic, Michael Sunnyvale, US 13 104
Rim, Seung Palo Alto, US 6 50

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