Substrate and the method to fabricate thereof

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United States of America Patent

PATENT NO 9859250
SERIAL NO

14492088

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Abstract

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The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.

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Patent Owner(s)

Patent OwnerAddress
CYNTEC CO LTDNO 2 R&D 2ND RD SCIENCE-BASED INDUSTRIAL PARK HSINCHU 30076

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Bau-Ru Changhua County, TW 47 191
Lu, Shao Wei Hsinchu County, TW 7 44
Wu, Ming-Chia Hsinchu, TW 20 105

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