Label Application System
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Dec 15, 2014
filing date -
Dec 30, 2013
priority date (Note) -
Published
status (Latency Note)
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Abstract
According to an aspect, the present invention is directed to a method for applying a label to a substrate. The method includes applying an ink layer to a transfer mechanism; applying a binding layer to the ink layer; and contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism.
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