Resin composition and uses of the same

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United States of America Patent

PATENT NO 9657154
APP PUB NO 20150183952A1
SERIAL NO

14582233

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Abstract

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A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

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Patent Owner(s)

  • TAIWAN UNION TECHNOLOGY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Huei Chupei, TW 19 50
Liu, Shur-Fen Chupei, TW 59 328
Wu, Hsin-Ho Chupei, TW 12 24

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