Signal monitoring of through-wafer vias using a multi-layer inductor

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United States of America Patent

PATENT NO 9372208
APP PUB NO 20150185273A1
SERIAL NO

14146162

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Abstract

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According to a method herein, a multi-level inductor is created around a through-silicon-via (TSV) in a semiconductor substrate. A voltage induced in the multi-level inductor by current flowing in the TSV is sensed, using a computerized device. The voltage is compared to a reference voltage, using the computerized device. An electrical signature of the TSV is determined based on the comparing the voltage to the reference voltage, using the computerized device.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DiRocco, Mark A South Burlington, US 4 8
Peterson, Kirk D Jericho, US 152 1142
Robson, Norman W Hopewell Junction, US 13 62
Stevens, Keith C Fairfield, US 9 96

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