Placing integrated circuit devices using perturbation

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United States of America Patent

PATENT NO 9638747
SERIAL NO

14141718

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Abstract

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Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abazarnia, Nader N Chandler, US 9 32
Diglio, Paul J Chandler, US 10 12
Jensen, Morten S Mesa, US 6 46
Sanchez, Rene J Chandler, US 5 26
Schroeder, Christopher R Gilbert, US 6 42

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