COPPER ALLOY WIRE AND COPPER ALLOY WIRE MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20150187452A1
SERIAL NO

14413107

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Abstract

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This copper alloy wire consists of a precipitation strengthening type copper alloy containing Co, P, and Sn, wherein an average grain size of precipitates observed through cross-sectional structure observation immediately after performing an intermediate aging heat treatment is equal to or less than 15 nm and a number of precipitates having grain sizes of equal to or less than 5 nm is 10% or higher of a total number of observed precipitates, and the copper alloy wire is subjected to cold working and a final aging heat treatment after the intermediate aging heat treatment.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION3-2 OTEMACHI 1-CHOME CHIYODA-KU TOKYO 1008117
MITSUBISHI CABLE INDUSTRIES LTD4-1 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ashida, Tetsuya Amagasaki-shi, JP 40 367
Ishida, Norikazu Tokyo, JP 13 25
Maki, Kazunari Kitamoto-shi, JP 69 185
Mori, Hiroyuki Kitamoto-shi, JP 394 3164
Nakamoto, Hitoshi Osaka, JP 7 37

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