DIE PACKAGE ARCHITECTURE WITH EMBEDDED DIE AND SIMPLIFIED REDISTRIBUTION LAYER
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Dec 26, 2013
filing date -
Dec 26, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A die package architecture with an embedded die and simplified redistribution layer is described. In one example a method includes attaching a front side of a die to a temporary carrier panel applying a molding compound around the die and over the temporary carrier panel. Removing the temporary carrier, applying a metal routing layer over the front side of the die and the molding compound, and applying a connection array to the metal routing layer.
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