Biometric Image Sensor Packaging and Mounting
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United States of America Patent
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Issued Date -
Jul 2, 2015
app pub date -
Mar 16, 2015
filing date -
Oct 14, 2012
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Abstract
A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.
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