Chip stack with electrically insulating walls

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United States of America Patent

PATENT NO 9418976
APP PUB NO 20150187739A1
SERIAL NO

14660035

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Abstract

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A method of forming a chip stack is provided and includes arraying solder pads along a plane of a major surface of a substrate forming walls of electrically insulating material between adjacent ones of the solder pads.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colgan, Evan G Chestnut Ridge, US 140 2839
Nah, Jae-Woong New York, US 154 1157

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