LIGHT-EMITTING DIODE ELEMENTS
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United States of America Patent
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Jul 2, 2015
app pub date -
May 19, 2014
filing date -
Dec 26, 2013
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Abstract
A light-emitting diode element is provided. N light-emitting diode chips are arranged on a substrate. Each light-emitting diode chip includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode, and a second electrode. The first-type semiconductor layer is disposed on the substrate. The active layer is disposed on the first-type semiconductor layer to bare a surface of a portion of the first-type semiconductor layer. The second-type semiconductor layer is disposed on the active layer. The first and second electrode are disposed on the first-type and second-type semiconductor layers respectively. The second electrode is close to a side of the second-type semiconductor layer which is opposite side of the first-type semiconductor layer. First and second connection lines connect the first electrode of an i-th light-emitting diode chip and the second electrode of an (i+1)-th light-emitting diode chip among the light-emitting diode chips.
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