HYDROPHILIC RESIN COMPOUND HAVING SUGAR CHAIN AFFIXED THERETO, POLYMER SUBSTRATE FOR VIRUS-REMOVAL, AND BIOCOMPATIBLE MATERIAL

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United States of America Patent

APP PUB NO 20150190563A1
SERIAL NO

14415379

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Abstract

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Provided is: a resin compound having an immobilized sugar chain, obtained by reacting a an epoxy-group-containing compound (B) with a hydrophilic resin (A), followed by reacting an amino-group-containing compound (C) therewith, and then reacting a sugar therewith; a virus-removal-polymer substrate obtained by coating the resin compound on a polymer support to immobilize a sugar chain that can adsorb a virus; and a biocompatible material using the resin compound.

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Patent Owner(s)

Patent OwnerAddress
DIC CORPORATIONTOKYO
NATIONAL UNIVERSITY CORPORATION HAMAMATSU UNIVERSITY SCHOOL OF MEDICINE20-1 HANDAYAMA 1 CHOME HIGASHI-KU HAMAMATSU-SHI SHIZUOKA 431-3192

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikushima, Naoya Sakura-shi, JP 10 48
Nakaguma, Hirohide Sakura-shi, JP 7 57
Sakurai, Naoto Sakura-shi, JP 56 253
Suzuki, Tetsuro Hamamatsu-shi, JP 114 2068

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