SEMICONDUCTOR SECURED TO SUBSTRATE VIA HOLE IN SUBSTRATE
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United States of America Patent
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Issued Date -
Jul 9, 2015
app pub date -
Jul 11, 2012
filing date -
Jul 11, 2012
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Abstract
A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.
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