Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist

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United States of America Patent

PATENT NO 9416243
APP PUB NO 20150191588A1
SERIAL NO

14411843

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Abstract

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The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTD128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Bo Yun Daejeon, KR 8 16
Choi, Byung Ju Daejeon, KR 10 13
Jeong, Min Su Daejeon, KR 10 15
Jeong, Woo Jae Daejeon, KR 13 15
Ku, Se Jin Daejeon, KR 38 429
Lee, Kwang Joo Daejeon, KR 50 56

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